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Glove box Product List and Ranking from 44 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Glove box Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 神港精機 東京支店 Tokyo//Industrial Machinery
  2. アイビック・リサーチ Ibaraki//Testing, Analysis and Measurement
  3. UNICO 　　つくばフロンティア・ラボ Ibaraki//Testing, Analysis and Measurement
  4. 4 エイエルエステクノロジー Kanagawa//Testing, Analysis and Measurement
  5. 5 UNICO 　　東京技術センター(Ｔ.Ｔ.Ｃ) Tokyo//Manufacturing and processing contract
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Glove box Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Powder Artificial Gastric Juice Artificial Intestinal Juice BioWise アイビック・リサーチ
  2. Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment" ワッティー
  3. Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device) 神港精機 東京支店
  4. SDR-type roll-to-roll sputtering device (RtoR type sputtering device) 神港精機 東京支店
  5. 5 Polyimide cure device (300mm wafer compatible clean bake device) 神港精機 東京支店

Glove box Product List

1～15 item / All 231 items

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General-purpose glove box

General-purpose glove box

A box capable of adjusting the oxygen and moisture atmosphere within the necessary box.

The "General Use Glove Box" is a box that allows for the adjustment of the oxygen and moisture atmosphere inside the box according to the combination of options suited for the intended use. Our company participates from the planning stage to streamline production lines that are directly linked to our customers' management. We propose optimal automation and labor-saving solutions. 【Features】 ■ It is possible to adjust the oxygen and moisture atmosphere inside the box according to the combination of options suited for the intended use. *For more details, please feel free to contact us.

  • Glove box

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Absolute humidity dew point thermometer / Model number MI1T-3321

Absolute humidity dew point thermometer / Model number MI1T-3321

The MI1T-3321 temperature and humidity meter is a high-precision multifunction digital thermometer and hygrometer that can measure temperature, humidity, absolute humidity, dew point temperature, and wet bulb temperature all in one device.

It quickly displays humidity using the latest high-precision resistive humidity sensor.

  • others
  • Other electronic measuring instruments

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Dew Point Control Dry Glove Box "Euphony Ace"

Dew Point Control Dry Glove Box "Euphony Ace"

Ultra-low dew point dry air glove box as a replacement for inert gas type.

The dew point control dry glove box "Euphony Ace" accurately creates a wide range of testing environments with a single device. It allows for quality evaluation from ultra-low dew point environments in the research phase to practical low-cost production environments. Additionally, it can maintain a dew point control accuracy within ±1.5°C stably over a long period, providing reliable experimental data. 【Features】 ○ Affordable price and low running costs for peace of mind ○ Low noise, safe for use in laboratories ○ Uses dry air for safety and reassurance For more details, please contact us or download the catalog.

  • Glove box

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Multi-purpose sputtering device

Multi-purpose sputtering device

Support from research and development to mass production!

Supported by highly reliable standard hardware and a wealth of experience, Shinko Seiki has been active in many fields since launching its first machine in 1967. We provide state-of-the-art equipment that consistently leads the way with flexible and advanced software.

  • Sputtering Equipment
  • Printed Circuit Board
  • Other semiconductors

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Annealing device "Variable Atmosphere Heat Treatment Device"

Annealing device "Variable Atmosphere Heat Treatment Device"

Capable of processing various substrates such as wafers and glass; a variable atmosphere heat treatment device compatible with a wide range of applications (supports sample testing in O2 or H2 atmosphere annealing).

We offer a rapid temperature rise and fall type "horizontal annealing device" that can be processed in vacuum, oxygen atmosphere (at atmospheric pressure), and reducing atmosphere (at atmospheric pressure). It is capable of processing various substrates (wafers, ceramics, glass, mounted substrates) up to 6 inches, and has a proven track record in applications such as annealing of thin films and wafers, firing of nano metal pastes, and curing of organic materials. For those who wish to evaluate our equipment, we offer sample testing. Please contact us for details on specifications and available test contents. 【Features】 ■ Uniform heating treatment in various atmospheres (vacuum, N2, O2, H2) (up to 900°C) ■ Rapid cooling through the movement of the heating furnace body ■ Processing in a clean atmosphere using quartz tubes ■ Wide range of application support *For more details, please feel free to contact us.

  • Other physicochemical equipment
  • Heating device

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ICP metal etching equipment

ICP metal etching equipment

Supports etching of fine patterns of metal films such as Al and Cr! Demo machines available! Facility tours and sample testing are currently being conducted.

The "ICP Metal Etching Device" is a high-density plasma etching device compatible with metal films, designed for advanced thin film processes. It actively supports not only general devices such as semiconductors and MEMS but also special processes like surface treatment for exposure masks and metal substrates. Thanks to its unique chamber structure, it achieves metal etching with low particle contamination at the nm level, characterized by high yield and operational efficiency. 【Features】 ■ Precision etching of metal films at the nm level ■ Low particle process through a unique mechanism ■ Process compatibility for a wide range of applications, including metal films and compound semiconductor substrates ■ High reliability of hardware leveraging the basic configuration of "SERIO" for nanoimprint molds ■ Active support for not only wafers but also special materials and shaped substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Etching Equipment
  • Plasma surface treatment equipment

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Batch-type plasma reflow device (flux reflow)

Batch-type plasma reflow device (flux reflow)

Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.

Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.

  • Other semiconductor manufacturing equipment

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Batch-type vacuum soldering device (fluxless reflow vacuum reflow)

Batch-type vacuum soldering device (fluxless reflow vacuum reflow)

Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.

Batch-type vacuum soldering equipment that achieves high-reliability soldering. High-speed and uniform soldering in a low-oxygen atmosphere through vacuum evacuation. Achieves a high level of void-free soldering through combinations of vacuum, atmospheric pressure, and various atmospheres (reduction, inert). A basic model of the standard process for high-reliability power modules for automotive applications. A new model has been introduced to increase processing capacity and performance. The new model has been installed at the factory. Actively responding to equipment tours and sample tests. Conducting void-free, flux-free soldering tests, including plasma cleaning for pre-treatment. ★ We will exhibit at NEPCON Japan 2020! * For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Soldering Equipment
  • Electric furnace

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Polyimide cure device (300mm wafer compatible clean bake device)

Polyimide cure device (300mm wafer compatible clean bake device)

300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.

High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.

  • Annealing furnace

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Standard Batch Type Sputtering Device (SRV Series)

Standard Batch Type Sputtering Device (SRV Series)

Multi-functional, compact, flexible support, a standard lineup with proven results and trust.

A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Research and development sputtering equipment

Research and development sputtering equipment

Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.

Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.

  • Sputtering Equipment

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SDR-type roll-to-roll sputtering device (RtoR type sputtering device)

SDR-type roll-to-roll sputtering device (RtoR type sputtering device)

Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.

Achieving mass production of flexible electronic devices represented by FPC with proven results. Reliable response to various individual requirements through process support using in-house demonstration equipment. Proven results with a wide range of substrates, including not only general resin films but also metal foils. Stable operation is realized through a high-utilization cathode developed in-house and a well-established transport mechanism. Equipped with a variety of optional mechanisms such as plasma pre-treatment electrodes, cathodes for magnetic materials, and main rolls for substrate heating, it can be operated as a multipurpose continuous film processing device. Flexible realization of hardware and software according to purpose and application, including small machines for R&D and batch-type equipment compatible with sheets.

  • Other processing machines
  • Sputtering Equipment
  • Plasma surface treatment equipment

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Mass production compatible batch-type sputtering system (Model STH10311)

Mass production compatible batch-type sputtering system (Model STH10311)

A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.

This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.

  • Sputtering Equipment

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Simple experimental deposition device (EM-645 type)

Simple experimental deposition device (EM-645 type)

Simple, compact, high-performance; ideal for experiments and basic research; flexibly customizable according to user needs; standard-type deposition device.

Covers all performance, cost, and technical support required for basic research, and can be customized according to individual requirements.

  • Evaporation Equipment
  • Other physicochemical equipment
  • Other surface treatment equipment

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Standard Batch Type Vapor Deposition Equipment (AMF Series)

Standard Batch Type Vapor Deposition Equipment (AMF Series)

Standard series for electronic device applications. A reliable and comprehensive lineup ranging from multipurpose small research units for R&D to mass production for well-established back electrode applications.

A lineup of standard deposition equipment that broadly supports everything from research and development of semiconductors, MEMS, and various electronic components (sensors, quartz oscillators, etc.) to full-scale mass production. All models are compatible with clean rooms and clean vacuum environments, equipped with various selection mechanisms. We respond meticulously to individual requests based on our extensive experience with standard specifications. Customization is available for evaporation sources, heating temperatures, substrate mechanisms (planetary dome, rotary dome), operation, and logging software. We also offer process testing with in-house demo units, providing a wide range of flexible hardware and support.

  • Evaporation Equipment
  • Other surface treatment equipment

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